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product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays 1/ 36 www.rohm.com t sz02201 - 09190g100110 - 1 - 2 21 . dec . 201 5 rev. 002 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 serial eeprom series standard eeprom microwire bus eeprom (3 - wire) b r93g 86 - 3 a general description br 93g 86-3 a is serial eeprom of serial 3 - line i nterface method . they are 16bit organization and cs pin is the first pin in their pin configuration. features 3 - line communications of chip select, serial clock, serial data input / output (the case where input and output are shared) operation s available at high speed 3mhz clock (4.5 v~5.5 v) high s peed write available (write time 5ms max. same package and pin configuration from 1kbit to 16kbit 1.7~5.5v single power source operation address auto increment function at read operation write mistake prevention function ? write prohibition at power on ? write prohibition by command code ? write mistake prevention function at low voltage self - timed programming cycle program condition display by ready / busy compact package sop8/sop - j8 /ssop - b8/tssop - b8/msop8/ tssop - b8j/dip - t 8/vson008x2030 more than 40 years data retention more than 1 million write cycles initial delivery state all addresses ffffh package s w (typ.) x d (typ.) x h (max.) br 93g 86-3 a *1 dip - t8 is not halogen free package capacity bit f ormat type power s ource voltage package 16 kbit 1024 16 b r 93g86 - 3 a 1.7 v to 5.5v dip - t8 b r 93g86f - 3 a sop8 b r 93g86fj - 3 a sop - j8 b r 93g86fv - 3 a ssop - b8 b r 93g86 fvt - 3 a tssop - b8 b r 93g86 fvj - 3 a tssop - b8j b r 93g86 fvm - 3 a mso p8 b r 93g86 nux - 3 a vson008x2030 dip - t8 9.30mm x 6.50mm x 7 .10mm sop8 5.00mm x 6.20mm x 1.71mm sop - j8 4.90mm x 6.00mm x 1.65mm ssop - b8 3.00mm x 6.40mm x 1.35mm tssop - b8 3.00mm x 6.40 mm x 1.20mm tssop - b8j 3.00mm x 4.90mm x 1.10mm msop8 2.90mm x 4.00mm x 0.90mm vson008x2030 2.00mm x 3.00mm x 0.60mm datashee t
2 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? absolute maximum ratings parameter symbol ratings unit remarks supply voltage vcc - 0.3 to + 6.5 v permissible d issipation pd 0. 80 (dip - t8) w when using at ta = 25 or higher 8.0mw to be reduced per 1 . 0. 45 (sop8) when using at ta = 25 or higher 4.5mw to be reduced per 1 . 0. 45 (sop - j8) when using at ta = 25 or higher 4.5mw to be reduced per 1 . 0. 30 (ssop - b8) when using at ta = 25 or higher 3.0mw to be reduced per 1 . 0. 33 (tssop - b8) when using at ta = 25 or higher 3.3mw to be reduced per 1 . 0. 31 (tssop - b8j) when using at ta = 25 or higher 3.1mw to be reduced per 1 . 0. 31 (msop8) when using at ta = 25 or higher 3.1mw to be reduced per 1 . 0. 30 (vson008x2030) when using at ta = 25 or higher 3.0mw to be reduced per 1 . storage temperat ure tstg >+ 6 5 to +15 0 operating temperature topr >+ 40 to + 8 5 input voltage / output voltage : - 0.3 to vcc + 1.0 v the max value of input v oltage /output voltage is not over 6.5v . when the pulse width is 50ns or less, the min value of input v oltage /outp ut voltage is not under - 0.8 v . junction temperature t jmax 150 junction temperature at the storage condition ? memory cell characteristics (vcc=1.7~5.5v) parameter limit unit condition min. typ. max. write cycles *1 1,000,000 - - times ta=25 dat a retention *1 40 - - years ta=25 ? shipment data all address ffffh *1 not 100% tested ? recommended o peration rating s parameter symbol limits unit supply voltage vcc 1.7~5.5 v input voltage v in 0~vcc
3 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? dc characteristics (unless otherwise specifi ed, vcc=1.7 ~ 5.5v, ta= - 40 ~ +85 ) parameter symbol limits unit condition min. typ. max. i nput low voltage v i l - 0.3 *1 - 0.3vcc v 1.7v vcc 5.5v i nput high voltage v ih 0.7vcc - vcc +1.0 v 1.7v vcc 5 .5v o utput low voltage 1 v ol 1 0 - 0.4 v i ol = 2.1 ma , 2.7v vcc 5.5v o utput low voltage 2 v ol 2 0 - 0.2 v i ol = 10 0 a a
4 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? ac characteristics (unless otherwise specified, vcc=1.7 ~ 2.5v, ta= - 40 ~ +85 ) parameter symbol limits unit min. typ. max. sk frequency f sk - - 1 mhz sk high time t skh 250 - - ns sk low time t skl 250 - - ns cs low time t cs 250 - - ns cs setup time t c ss 200 - - ns di setup time t dis 100 - - ns cs hold time t csh 0 - - ns di hold time t dih 100 - - ns data
5 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? s erial input / output timing ? data is taken by di sync with the rise of sk. ? at read operation , data is output from do in sync with the rise of sk. ? the status signal at write (ready / busy) is output after t cs from the fall of cs after write command input, at the area do where cs is high , and valid until the next command start bit is input. and, while cs is low , do becomes high - z. ? after completion of each mode execution, set cs low once for internal circuit reset, and execute the following operation mode. ? 1/f sk is the sk clock cycle, even if f sk is maximum, the sk clock cycle can figure 1 . sync data input / output timing figure 2 . block diagram command decode control clock generation power source voltage detection write prohibition high voltage occurrence command register address buffer sk di dummy bit do data register r/w amplifier 10 bit 10 bit 16bit 16bit 16 , 384 bit eeprom cs address decoder cs sk do(read) di do( write ) t css t skh t skl t csh t dis t d ih t pd1 t pd0 t df status valid t sv 1/ f sk
6 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? pin configuration ? pin description s figure 3 . pin configuration pin name i / o function cs input chip select input sk input serial clock input di input start bit, ope code, address, and serial data input do output serial data output, ready / busy DDDDD
7 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s figure 4 . i nput high voltage v ih (cs,sk,di) figure 5 . i nput low voltage v il (cs,sk,di) figure 6 . o utput low voltage1 v ol 1 (vcc= 2 .7v) figure 7 . o utput low voltage2 v ol 2 (vcc= 1 .7v) 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) input low voltage : v il (v) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 output low current:i ol (ma) output low voltage1 : v ol1 (v) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) input high voltage : v ih (v) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 output low current : i ol (ma) output low voltage2 : v ol2 (v) spec ta=-40 ta= 25 ta= 85
8 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s : continued figure 8 . o utput high voltage1 v oh 1 (vcc= 2 .7v) figure 9 . o utput high voltage2 v oh 2 (vcc= 1 .7v) figure 10 . input leak age current1 i li1 (cs) figure 11 . input leak age current 1 i li 1 ( sk ) 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) input leakage current1 : i li1 (ua) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 0 0.4 0.8 1.2 1.6 output high current: i oh (ma) output high voltage2 : v oh2 (v) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 0 0.4 0.8 1.2 1.6 output high current: i oh (ma) output high voltage1 : v oh1 (v) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) input leakage current1 : i li1 (ua) spec ta=-40 ta= 25 ta= 85
9 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s : continued figure 1 2 . in p ut leak age current 1 i l i1 (d i ) figure 1 3 . output leak age current i lo (do) figure 1 4 . supply c urrent ( write ) i cc1 (write, f sk =1mhz) figure 1 5 . supply c urrent ( write ) i cc1 (write,f sk =3mhz) 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) input leakage current1 : i li1 (ua) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage: vcc(v) output leakage current : i lo (ua) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (write) : i cc1 (ma) spec ta=-40 ta= 25 ta= 85 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (write) : i cc1 (ma) spec ta=-40 ta= 25 ta= 85
10 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s : continued figure 1 6 supply c urrent ( read ) i cc2 (read,f sk =1mhz) . figure 1 7 . supply c urrent ( read ) i cc2 (read,f sk =3mhz) figure 1 8 . supply c urrent ( wral ) i cc3 (wral,f sk =1mhz) figure 1 9 . supply c urrent ( wral ) i cc3 (wral,f sk =3mhz) 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (read) : i cc2 (ma) spec ta=-40 ta= 25 ta= 85 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (read) : i cc2 (ma) spec ta=-40 ta= 25 ta= 85 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (wral) : i cc3 (ma) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 0 1 2 3 4 5 6 supply voltage: vcc(v) supply current (wral) : i cc3 (ma) spec ta=-40 ta= 25 ta= 85
11 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s : continued figure 20 . standby c urrent i sb1 ( cs=0v ) figure 21 . sk frequency f sk figure 2 2 . sk high time t skh fig ure 2 3 . sk low time t skl 0.01 0.1 1 10 100 1000 0 1 2 3 4 5 6 supply voltage: vcc(v) sk frequency : f sk (mhz) spec ta=-40 ta= 25 ta= 85 spec spec 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) sk high time : t skh (ns) spec ta=-40 ta= 25 ta= 85 spec spec 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) sk low time : t skl (ns) spec ta=-40 ta= 25 ta= 85 spec spec 0 0.5 1 1.5 2 2.5 0 1 2 3 4 5 6 supply voltage: vcc(v) standby current : i sb1 (ua) spec ta=-40 ta= 25 ta= 85
12 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s : continued figure 2 4 . cs low time t cs figure 2 5 . cs hold time t csh figure 2 6 . cs setup time t css figure 2 7 . di setup time t dis 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) cs low time : t cs (ns) spec ta=-40 ta= 25 ta= 85 spec -300 -250 -200 -150 -100 -50 0 50 0 1 2 3 4 5 6 supply voltage: vcc(v) cs hold time : t csh (ns) spec ta=-40 ta= 25 ta= 85 0 50 100 150 200 250 300 0 1 2 3 4 5 6 supply voltage: vcc(v) cs setup time : t css (ns) spec ta=-40 ta= 25 ta= 85 spec -50 0 50 100 150 0 1 2 3 4 5 6 supply voltage: vcc(v) di setup time : t dis (ns) spec ta=-40 ta= 25 ta= 85 spec
13 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s : continued figure 2 8 . di hold time t dih figure 2 9 . data "0" out p ut delay t pd0 figure 30 . d ata "1" output delay t pd1 figure 31 . time from cs to output establishment t sv 0 200 400 600 800 1000 0 1 2 3 4 5 6 supply voltage: vcc(v) data "0" output delay : t pd0 (ns) spec ta=-40 ta= 25 ta= 85 spec -50 0 50 100 150 0 1 2 3 4 5 6 supply voltage: vcc(v) di hold time : t dih (ns) spec ta=-40 ta= 25 ta= 85 spec 0 200 400 600 800 1000 0 1 2 3 4 5 6 supply voltage: vcc(v) data "1" output delay : t pd1 (ns) spec ta=-40 ta= 25 ta= 85 spec 0 100 200 300 400 500 0 1 2 3 4 5 6 supply voltage: vcc(v) time from cs to output establishment : t sv (ns) spec ta=-40 ta= 25 ta= 85 spec
14 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? typical performance curve s : continued figure 3 2 . time from cs to high - z t df figure 3 3 . write cycle time t e/w 0 50 100 150 200 250 0 1 2 3 4 5 6 supply voltage: vcc(v) time from cs to high-z : t df (ns) spec ta=-40 ta= 25 ta= 85 spec 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage: vcc(v) write cycle time : t e/w (ms) spec ta=-40 ta= 25 ta= 85
15 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? description of operations communications of the micro w ire bus are carried out by sk (serial clock), di (serial data input),do (serial data output) ,and cs (chip select) for device selection. when to connect one eeprom to a microcontroller, connect it as shown in figure 34 (a) or figure 34 (b). when to use the input and output common i/o port of the microcontroller, connect di and d o via a resistor as shown in figure 34 (b) (refer to pages 21 , 22 . ), and connection by 3 lines is available. in the case of plural connections, refer to figure 34 (c). communications of the micro w ire bus are started by the first
16 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? timing chart 1) read cycle (read) *1 start bit when data cs 1 2 1 5 high - z 0 0 0 d x d x - 1 d1 d0 sk di do n status t cs t sv busy t e/w ready 1 cs 1 2 1 4 high - z 1 am a1 a0 0 d x d x - 1 d1 d x d x - 1 *1 *2 d0 sk di do 0 n n+1 * 2 cs 1 2 1 4 high - z 0 am a1 a0 d x d x - 1 d1 d0 sk di do 1 n status t cs t sv busy t e/w ready
17 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 4) write enable (wen) / disable (wds) cycle for the meaning of n ,please see table s of command mode in page1 5 . ? at power on, this ic is in write disable status by the internal reset circuit. before executing the wri te command, it is necessary to execute the write enable command. and, once this command is executed, it is valid unitl the write disable command is executed or the power is turned off. however, the read command is valid irrespective of write enable / diabl e command. input to sk after 6 clocks of this command is available by either cs 1 2 1 4 high - z sk di do status t cs t sv busy t e/w ready 1 n 0 0 0 cs 1 2 1 5 high - z 0 0 sk di do n 3 4 6 7 8 enabl e =1 1 disabl e =0 0 cs 1 2 1 1 1 4 high - z sk di do status t cs t sv busy t e/w ready am a3 a2 a1 n a0
18 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? application 1) method to cancel each command ? read ? write,wral ? erase, eral *1 for the meaning of m,x, please see table s of command mode in page1 5 figure 41 . read cancel available timing note 1) if v cc is made off in this area, designated address data is not guaranteed, therefore write once again is suggested . note 2 ) if cs is started at the same timing as that of the sk rise, write execut ion/cancel becomes unstable, therefore, it is recommended to fall in sk= low area. as for sk rise, recommend timing of t css /t csh or higher. figure 42 . write, wral cancel available timing 1bit 2b it m+1bit x+1bit cancel is available in all areas in read mode. ? a >8 from start bit to the clock rise of d0 taken cancel by cs= low b >8 the clock rise of d0 taken and after cancellation is not available by any means. c >8 n+1 clock rise and after cancel by cs= low however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously cancel function is not available. a *1 1bit 2bit m+1bit x+1bit c b *1 for the meaning of m, n , x, please see table s of command mode in page1 5 *1 figure 43. erase, eral cancel available timing a >8 from start bit to clock rise of a0 taken cancel by cs= low b >8 clo ck rise of a0 taken cancellation is not available by any means. c >8 n+1 clock rise and after cancel by cs= low however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is output continuously c ancel function is not available. note 1) if v cc is made off in this area, designated address data is not guaranteed, therefore write once again is suggested. note 2 ) if cs is started at the same timing as that of the sk rise, write execution/cance l becomes unstable, therefore, it is recommended to fall in sk= low area. as for sk rise, recommend timing of t css /t csh or higher. *1 for the meaning of m, n, please see table s of command mode in page1 5 clock rise of a0 taken sk di n - 1 a1 n n+1 n+2 b c a enlarged figu re a0 clock rise of d0 taken sk di n - 1 d1 d0 n n+1 n+2 b enlarged figure c a a1 1bit 2bit m+1bit a c b *1 start bit ope code address data start bit ope code address t e/w start bit ope code address data t e/w
19 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 2) at standby when cs is low , even if sk,di,do are low , high or with middle electric potential, current does not over i sb1 max . 3) i/o peripheral circuit 3 - 1) pull down cs. by making c s= low at power on/off, mistake in operation and mistake write are prevented. ? pull down resistance r cs of cs pin to prevent mistake in operation and mistake write at power on/off, cs pull down resistance is necessary. select an appropriate value to this r esistance value from microcontroller v oh , i oh , and v il characteristics of this ic. 3 - 2) do is available in both pull up and pull down. do output always is high - z except in ready / busy status and data output in read command. malfunc tion may occur when high - z is input to the microcontroller port connected to do, it is necessary to pull down and pull up do. when there is no influence upon the microcontroller operation s, do may be open. if do is open, and at timing to output status read y, at timing of cs= high , sk= high , di= high , eeprom recognizes this as a start bit, resets ready output, and do= high - z , therefore, ready signal cannot be detected. to avoid such output, pull up do pin for improvement. figure 45 . ready out put timing at do=open figure 44 . cs pull down resistance v ohm i ohm r cs q 2.4 2 ? 10 - 3 ? r cs 1.2 [k ] v oh m v ihe r r cs example) when v cc = 5 v , v ihe =2v, v ohm =2.4v, i ohm =2ma, from the equation q , v ihe v ohm i ohm with the value of rpd to satisfy the above equation, v ohm becomes 2.4v or higher, and v ihe (=2.0v), the equation r is als o satisfied. : eeprom vih specifications : microcontroller v oh specifications : microcontroller i oh specifications microcontroller v ohm high output i ohm r cs v ihe low input eeprom 0 cs sk di do d0 busy ready high - z enlarged cs sk di do busy high - z improvement by do pull up busy ready cs=sk=di= high when do=open cs=sk=di= high when do =pull up do high
20 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? pull up resistance rpu and pull down resistance rpd of do pin as for pull up and pull down resistance value, select an appropriate value to this resistance value from microcontroller v ih , v il , and v oh , i oh , v ol , i ol characteristics of this ic. ? ready / busy status display (do terminal) this display outputs the internal status signal. when cs is started after t cs from cs fall after write command input, high or low is output. r/b displ ay >; low (busy) = write under execution after the timer circuit in the ic works and creates the period of t e/w , this timer circuit completes automatically. and the memory cell is written in the period of t e/w , and during this period, ot her command is not accepted. r/b display = high (ready) = command wait status after t e/w (max.5ms) the following command is accepted. therefore, cs= high in the period of t e/w , and if signals are input in sk, di, malfunction may occur, therefore, di= low in the area cs= high . (especially, in the case of shared input port, attention is required.) *do not input any command while status signal is output. command input in busy area is cancelled, but command input in ready area is accepted. therefore, status ready output is cancelled, and malfunction and mistake write may occur. figure 46 . do pull up resistance rpu s 5 >+ 0.4 2.1 ? 10 - 3 ? rpu 2.2 [k ] v ole v ilm t rpu example) when v cc = 5 v , v ole =0.4v, i ole =2.1ma, v ilm =0.8v, from the equation s , v cc >+ v ole i ole with the value of rpu to satisfy the above equation, v ole becomes 0.4v or below, and wi th v ilm (=0.8v), the equation t is also satisfied. rpd u 5 >+ 0.2 0.1 ? 10 - 3 ? rpd 48 [k ] v ohe v ihm v rpd example) when vcc = 5 v , v ohe = v cc >+ 0.2v, i ohe =0.1ma, v ihm = v cc ? 0.7v from the equation u , v ohe i ohe with the value of rpd to satisfy the above equation, v ohe bec omes 2.4v or below, and with v ihm (=3.5v), the equation v is also satisfied. figure 47 . do pull down resistance >& do status >' >& do status >' figure 48 . r eady /b usy status output timing chart : eeprom v ol specifications : eeprom i ol specifications : microcontroller v il specifications v ole i ole v ilm : eeprom v oh specifications : eeprom i oh specifications : microcontroller v ih specifications v ohe i ohe v ihm cs high - z sk di d o clock write instruction ready status t sv busy t e/w microcontroller v ih m high input i o h e v o h e high output eeprom rpd microcontroller v il m low input i o le v ole low output eeprom rpu
21 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 4) when to directly connect di and do this ic has independent input terminal di and output terminal do, and separate signals are handled on timing chart, meanwhile, by inserting a resistance r between these di and do terminals, it is possible to carry out control by 1 control li ne. ? data collision of microcontroller di/o output and do output and feedback of do output to di input of eeprom. drive from the microcontroller di/o output to di input of eeprom on i/o timing, and output signal from do output of eeprom occur at the same time in the following points. 4 - 1) 1 clock cycle to take in a0 address data at read command dummy bit figure 49 . di, do control line common connection figure 50 . collision timing at read data output at di, do direct connection figure 51 . collision timing at di, do direct connection figure. 52 start bit input timing at di, do direct connection *1 *1 x=15,f o r the meaning of x , please see table s of command mode in page1 5 . microcontroller di/o port di eeprom do r eeprom cs input eeprom sk input eeprom di input eeprom do out put microcontroller di/o port a1 high - z collision of di input and do output high a 0 0 d x d x - 1 d x - 2 a1 a0 high - z microcontroller output microcontroller i nput eeprom cs input eeprom sk input eeprom di input eeprom do out put microcontroller di/o port write command microcontroller output busy busy ready ready ready collision of di input and do output high - z write command write command write command write command microcontroller in put microcontroller output cs sk di do ready high - z start bit because di= high , set sk= low at cs rise.
22 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? selection of resistance value r the resistance r becomes through current limit resistance at data collision. when through current fl ows, noises of power source line and instantaneous stop of power source may occur. when allowable through current is defined as i, the following relation should be satisfied. determine allowable current amount in consideration of impedance and so forth of power source line in set. and insert resistance r, and set the value r to satisfy eeprom input level v ih /v il even under influence of voltage decline owing to leak current and so forth. insertion of r will not cause any influence upon basic operations. 4 - 3 ) address data a0 = C C C C C m icrocontroller di/o port di eeprom do r low output i o l m v olm v ohe high output m icroc o ntroller di/o port di eeprom do r high output i ohm v ohm v ole low output
23 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 5) i/o e quivalence circuit 6) power - up /down conditions ? at power on/off, set cs low . when cs is high , this ic gets in input accept status (active). if power is turned on in this status , noises and the likes may cause malfunction, mistake write or so. to prevent these, at power on, set cs low . (when cs is in low status all inputs are cancelled.) and at power decline, owing to power line capacity and so forth, low power status may continue long. at this case too, owing to the same reason, malfunction , mistake write may occur, therefore, at power off too, set cs low . ? por citcuit this ic has a por (power on reset) circuit as a mistake write countermeasure. after por operation , it gets in write disable status . the por circuit is valid only when power is on, and does not work when power is off. however, if cs is high at power on/off, it may become write enable status owing to noises and the likes. for secure operation s, observe the follwing conditions. 1. set cs= low 2. turn on power so as to satisfy the recommended conditions of t r , t off , vbot for por circuit operation . ? lvcc circuit lvcc (vcc - lockout) circuit prevents data rewrite operation at low power, and prevents wrong write. at lvcc voltage (typ.=1.2v) or below, it prevent data rewrite figure 55 . o utput circuit (do) figure 57 . input circuit (di) figure 56 . input circuit (cs) figure 58 . input circuit (sk) figure 59 . timing at power on/off fig ure 60 . rise waveform diagram >& bad example >' cs pin is pulled up to v cc in this case, cs becomes high (active status), and eeprom may have malfunction, mistake write owing to noise and the likes. even when cs input is high - z, the status becomes like this case, which please note. >& good example >' it is low at power on/off. set 10ms or higher to recharge at power off. when po wer is turned on without observing this condition, ic internal circuit may not be reset, which please note. recommended conditions of t r , t off , vbot t r t off vbot 10ms or below 10ms or higher 0.3v or below 100ms or bel ow 10ms or higher 0.2v or below t off t r vbot 0 v cc input citcuit cs csint. reset int. input circuit di cs int. input circuit sk cs int. output circuit do oeint. v cc gnd v cc gnd v cc cs bad example g ood example
24 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 7)noise countermeasures ? vcc noise (bypass capacitor) when noise or sur ge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a by pass capacitor (0.1
25 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? operational notes (1) described numeric values and data are design representative values, and the values are not guaranteed . (2) we believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further suff iciently. in the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our lsi. (3) absolute m aximum ratings if the absol ute maximum ratings such as supply voltage and operating temperature range and so forth are exceeded, lsi may be destructed. do not impress voltage and temperature exceeding the absolute maximum ratings. in the case of fear excee ding the absolute maximum ratings, take physical safety countermeasure s such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to lsi. (4) gnd electric potential set the voltage of gnd terminal lowest a t any operating condition. make sure that each terminal voltage is not lower than that of gnd terminal in consideration of transition status . (5) heat design in consideration of allowable loss in actual use condition, carry out heat design with sufficient margin. (6) terminal to terminal short circuit and wrong packaging when to package lsi onto a board, pay sufficient attention to lsi direction and displacement. wrong packaging may destruct lsi. and in the case of pin short between lsi terminals and term inals, terminals and power source, terminals and gnd owing to unconnect use, lsi may be destructed . (7) using this lsi in a strong electromagnetic field may cause malfunction, therefore, evaluate the design sufficiently .
26 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? part numb ering b r 9 3 g 8 6 x x x >+ 3 x x x x x orderable part number package remark type quantity br 93g86 - 3a dip - t8 tube of 20 00 not halogen free 100% sn br 93g86 f - 3a gte2 sop8 reel of 25 00 halogen free 100% sn br 93g86 fj - 3a gte2 sop - j8 reel of 25 00 halogen free 100% sn br 93g86 fv - 3a gte2 ssop - b8 reel of 25 00 halogen free 100% sn br 93g86 fvt - 3a ge2 tssop - b8 reel of 30 00 halogen free 100% sn br 93g86 fvj - 3a gte2 tssop - b8j reel of 25 00 halogen free 100% sn br 93g86 fvm - 3a gttr msop8 reel of 30 00 halogen free 100% sn br 93g86 nux - 3a ttr vson008x2030 reel of 40 00 halogen free 100% sn bus type 93 >8 microwire operating temperature / operating voltage - 40 to +85 / 1.7v to 5.5v p rocess code pin assignment blank: pin1~8: cs, sk, di, do, gnd, org, du, vcc respectively a : pin1~8: cs, sk, di, do, gnd, nc, du, vcc respectively b : pin1~8: du , vcc, cs, sk, di, do, gn d, nc respectively 86=16k capacity package blank :dip - t8 f :sop8 fj :sop - j8 fv :ssop - b8 fvt :tssop - b8 fvj :tssop - b8j fvm :msop8 nux :vson008x2030 packaging and forming specification e2 : embossed tape and reel ( sop8 , sop - j8, ssop - b8,tssop - b8, tssop - b8j) tr : embossed tape and reel (msop8, vson008x2030) blank : tube (dip - t8) g : halogen free blank: not halogen free as an exception, vson008x2030 package will be halogen free with
27 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? physical dimension s tape and reel information package name dip - t8
28 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 package name sop8 (unit : mm) pkg : sop8 drawing no. : ex11 2 - 5001 - 1 (max 5.35 (include.burr))
29 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 pa ckage name sop - j8
30 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 package name ssop - b8
31 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 package name tssop - b8
32 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 package name tssop - b8j
33 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 package name msop8
34 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 package name vson008x2030
35 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? marking diagrams dip - t8 (top view) br93g 8 6 a part number marking lot number sop8(top view) part number marking lot number 1pin mark sop - j8(top view) part number marking lot number 1pin mark tssop - b8(top view) part number marking (a0, a1, a2 , scl, wp) lot number 1pin mark tssop - b8j(top view) part number marking lot number 1pin mark ssop - b8(top view) part number marking lot number 1pin mark vson008x2030 (top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark 9g 8 6 a 9g 8 6 a 9 g ea 9 g 8 6 a 9g 8 9g e 9g 8 6 3 6 a 3 6 a 3 a g 3
36 / 36 br93g 86 - 3 a www. rohm.com t sz02201 - 09190g100110 - 1 - 2 2 1 . dec . 201 5 rev. 00 2 ? 20 12 rohm co., ltd. all rights reserved. tsz22111 15 001 ? revision history date revision changes 2 1 . jan .201 3 001 new release 21 . dec .2015 002 p.1 change format of pa ckage line - up table . p. 2 change remark of power dissipasion . p.26 add the list of part numbering. p.27 correct wrong size of physical dimensions. wrong : the body thickness is 3.4 s 0.3 correct : the leugth from high side of the body to the stopper of termin al is 3.4 s 0.3 p . 28 - 34 change the format of physical dimensions.
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number br93g86-3a package dip-t8 unit quantity 2000 minimum package quantity 50 packing type tube constitution materials list inquiry rohs yes br93g86-3a - web page distribution inventory

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